Item | Performance Index | Specifications |
Copper Content Of Substrate | ≥99.97% | Thickness:0.035mm~o.1mm Width:2.0mm~20mm |
Substrate Resistivity | ≤0.01724 Ω·m㎡/m | |
The Fusion Point Of Solder Coating | 189℃ | |
The Fusion Point Of Black Coating | 400℃ | |
Single Side Coating Thickness | 15~25μm | |
Thickness Tolerance | ±0.01mm | |
Width Tolerance | ±0.05mm | |
Elongation | ≥30% | |
Tensile Strength | ≥200MPa | |
Sickle Bending | ≤0.3% | |
Substrate Resistivity | ≤0.022Ω·m㎡/m |